Heat Sink Compound

Applications:

ASV 634 compound is used as a heat transfer media in the electrical and electronic industry for facilitating heat dissipation by filling voids and gaps between power components and heat sinks. Useful for the following applications:

Thermocouple Wells

Thermometer Wells

Mounting Power Diodes & Transistors

Shock & Heat Dissipation in Transistors

Mounting Semi-Conductor Devices

Heat Transfer Medium on Ballasts

Thermal Joints

Sensors

Thermistor

Benefits

 Wide service temperature range from -54°C to +200°C

 Low evaporation at high temperatures

 Very low bleed characteristics

 High thermal conductivity

 Exceptional oxidation stability

 Non melting, non-hardening and non-drying

Directions:

for Use, Use as supplied. Never dilute or mix with other oil or grease. Apply in small quantities on clean surfaces that are absolutely free from dust, foreign particles, or contaminants. Squeeze out extra compound by pressing both the surfaces after application and wipe clean to prevent accumulation of dirt & dust.